Electrostatic Discharge (ESD) is the sudden flow of electricity between two objects with different electrical potentials. It occurs when accumulated static charge is released, often through direct contact, electrical shorting, or dielectric breakdown.
In everyday life, ESD is the small shock you feel after walking on carpet and touching a metal object. In electronics manufacturing, however, ESD is a serious reliability risk that can silently damage sensitive components without visible sparks.
In semiconductor assembly, PCB manufacturing, cleanroom production, and electronics repair, uncontrolled electrostatic discharge can result in:
Catastrophic component failure
Latent defects that appear weeks later
Reduced product lifespan
Increased warranty returns
Production yield loss
Understanding what ESD is—and how to control it—is essential for any facility handling electronic components.
Electrostatic charge builds up primarily through triboelectric charging, which occurs when two materials contact and then separate. Different materials exchange electrons at different rates, causing one to become positively charged and the other negatively charged.
Common sources of static buildup include:
Walking across synthetic flooring
Removing tape or protective film
Sliding plastic trays
Handling insulating packaging materials
Low humidity environments
When a charged object comes into contact with a grounded or differently charged object, the electrical potential difference causes rapid discharge.
In electronics, ESD events are typically categorized into three models:
Simulates discharge from a charged human touching a device. This is one of the most common real-world ESD scenarios in manufacturing.
Occurs when the electronic device itself becomes charged and then discharges upon contact with ground.
Represents discharge from machinery or tools, though it is less emphasized in modern standards.
Each of these discharge models can damage microelectronic circuits, especially modern high-density semiconductor components.
Modern electronics are extremely sensitive to static discharge. Integrated circuits (ICs), MOSFETs, microprocessors, sensors, and fine-pitch components can be damaged by voltage levels far below what a human can feel.
A person may not feel static until around 3,000 volts. However, many semiconductor devices can be damaged at levels below 100 volts.
ESD damage can be:
Immediate and permanent damage that causes device malfunction during testing.
Microscopic damage that weakens the device structure but does not cause immediate failure. These components may fail prematurely in the field.
Occasional malfunction caused by partially degraded internal structures.
Latent damage is particularly dangerous because it passes quality control testing but reduces long-term reliability.
ESD control is essential in industries where electronic components are manufactured, assembled, or repaired.
Key sectors include:
Semiconductor fabrication
PCB assembly (SMT and DIP processes)
Electronics manufacturing services (EMS)
Telecommunications equipment
Medical electronics manufacturing
Automotive electronics production
Aerospace electronics
Cleanroom manufacturing environments
Even logistics operations that handle electronic devices must implement ESD-safe packaging and grounding procedures.
Static electricity is an imbalance of electric charge on the surface of materials. Insulators such as plastics, rubber, and synthetic fabrics tend to accumulate charge because electrons cannot easily move across their surfaces.
Conductive materials allow electrons to flow freely. Dissipative materials allow controlled movement of charge at a slower rate, preventing sudden discharge spikes.
This is why ESD control systems use materials classified as:
Conductive
Static dissipative
Insulative
Proper ESD protection requires selecting materials with controlled resistance characteristics.
Effective ESD control requires a complete system approach. Using a single anti-static product is not sufficient.
A comprehensive ESD protection program includes:
Operators should be grounded through:
Heel straps (where appropriate)
Grounding ensures that static charge is continuously dissipated rather than allowed to accumulate.
Workbenches should use ESD table mats with controlled resistance to prevent rapid discharge and allow safe charge dissipation.
ESD floor mats and permanent flooring systems work together with ESD shoes to maintain controlled grounding while personnel move throughout the facility.
Sensitive components must be stored and transported using:
Conductive foam
Anti-static containers
Ordinary plastic packaging can generate static and should never be used in ESD-protected areas.
In environments where insulating materials are unavoidable, ionizers neutralize airborne static charges by releasing balanced ions into the workspace.
Grounding systems must be regularly verified using ESD testing equipment to ensure continued compliance.
An ESD Protected Area (EPA) is a defined workspace where sensitive electronic components are handled under controlled electrostatic conditions.
An EPA typically includes:
Grounded work surfaces
Grounded personnel
ESD-safe tools
Controlled entry procedures
ESD signage and labeling
Routine verification processes
All items entering the EPA must meet ESD control requirements.
ANSI/ESD S20.20 is one of the most widely recognized standards for establishing, implementing, and maintaining an ESD control program.
Rather than specifying individual product values, it outlines a systematic approach to managing electrostatic risk.
Key elements include:
ESD control program documentation
Training requirements
Grounding specifications
Packaging controls
Verification procedures
Continuous improvement processes
Facilities certified under ANSI/ESD S20.20 demonstrate structured ESD management rather than isolated product usage.
In addition to ANSI standards, many global facilities follow IEC 61340 standards, particularly IEC 61340-5-1, which defines requirements for protecting electronic devices from electrostatic phenomena.
International manufacturers often align with both ANSI and IEC guidelines to ensure compliance across regions.
Not necessarily. Anti-static products may reduce charge buildup, but true ESD control requires controlled resistance and verification.
Most damaging ESD events are below human perception.
ESD protection must function as a system—flooring, footwear, wrist straps, packaging, and monitoring must work together.
Humidity affects static generation, but ESD risks exist year-round.
Regular verification ensures grounding systems remain effective.
Common ESD testing methods include:
Wrist strap testing
Footwear testing
Body voltage measurement
Surface resistance testing
Packaging material testing
Testing frequency depends on facility policy, risk level, and compliance requirements.
Southeast Asia has become a major hub for electronics manufacturing, including Thailand, Malaysia, Vietnam, Indonesia, and the Philippines.
With increased semiconductor packaging, PCB assembly, and cleanroom expansion in the region, ESD protection programs are becoming more standardized and compliance-driven.
Manufacturers operating in ASEAN markets increasingly require documented ESD control procedures and verified ESD-safe materials.
ESD stands for Electrostatic Discharge, the sudden transfer of static electricity between objects with different electrical potentials.
Electrostatic discharge is the rapid release of accumulated static electricity, which can damage sensitive electronic components.
ESD can cause catastrophic failure, latent defects, or intermittent malfunction by damaging semiconductor structures.
Semiconductor manufacturing, PCB assembly, cleanrooms, automotive electronics, telecommunications, and medical electronics all require ESD protection.
Preventing ESD requires grounding personnel, using ESD-safe surfaces and packaging, implementing ionization, and conducting regular verification testing.
Electrostatic Discharge is an invisible but serious threat in electronics manufacturing and handling environments. While static electricity may seem harmless in daily life, in industrial settings it can compromise product reliability and long-term performance.
Effective ESD control requires a structured system approach that includes grounding, proper materials, packaging, ionization, monitoring, and regular verification.
As electronics manufacturing continues to expand globally—particularly in Southeast Asia—the importance of implementing robust ESD protection programs will only increase.
A well-designed ESD control strategy protects not only electronic components but also product reputation, customer trust, and operational efficiency.
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